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Physical Vapour Deposition Systems
2000 & 2550 PVD Systems
Flexible Automated PVD Sputtering
The 2000 & 2550 Physical Vapour Deposition Systems are highly flexible automatic sputtering platforms engineered for advanced thin-film deposition and scalable vacuum processing applications.
Features
Advanced technologies supported through trusted global partnerships.
- Highly Flexible System Architecture
Configurable platform adapts to a wide range of deposition workflows.
- Multi-Cathode Deposition Capability
Four 200 mm or six 150 mm cathode configurations for versatile coating.
- Advanced RF/DC Magnetron Sputtering
Supports RF Diode, DC, RF and DC-RF magnetron operating modes.
- Precision Substrate Motion Control
Variable 2–30 rpm rotation with height-adjustable table.
Specifications
Technical profile.
Technology
Physical Vapour Deposition (PVD)
Deposition Method
Automatic Magnetron Sputtering
System Models
2000 / 2550
Cathode Options
Four 200 mm or Six 150 mm
Cathode Modes
RF Diode / DC / RF / DC-RF Magnetron
Substrate Rotation
2–30 rpm Variable Speed
Table Adjustment
Height Adjustable
Wafer Handling
Batch Load / Single Shot Load Lock
Vacuum Handling
Vacuum Cassette Load Lock (2550)
Substrate Compatibility
Multiple Substrate Formats
Operation Mode
Automated Thin Film Processing
Applications
Thin Film DepositionSemiconductor ProcessingOptical CoatingsMEMS FabricationResearch & Pilot ProductionMulti-Layer Coating Development