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Thin Film Deposition Systems
HEX Series – Modular Thin Film Deposition Systems
Highly Modular Thin-Film Deposition
The HEX Series is a next-generation modular PVD thin-film deposition platform engineered for advanced research, process development, and scalable materials innovation.
Features
Advanced technologies supported through trusted global partnerships.
- Unique Open-Frame Modular Architecture
Open hexagonal frame allows full access and configurable expansion.
- Multi-Process Thin Film Deposition
Supports sputtering, thermal, e-beam and organic evaporation in one platform.
- Future-Proof Expandable System
Add modules and sources as research needs evolve — no full system replacement.
- Advanced Automation & Process Control
Recipe-driven workflows, in-situ monitoring and full data logging.
Specifications
Technical profile.
Technology
Physical Vapor Deposition (PVD)
Deposition Methods
Sputtering, Thermal, E-Beam & Organic Evaporation
Power Compatibility
RF / DC / HiPIMS / Pulsed-DC
Chamber Design
Open-Frame Modular Architecture
System Variants
HEX / HEX-L / HEX-XL
Maximum Sample Size
Up to 12” (Model Dependent)
Deposition Sources
Up to 6 Sources
Base Pressure
Up to <5 × 10⁻⁷ mbar
Monitoring Options
QCM & In-Situ Process Monitoring
Software Features
Automation, Recipe Control & Data Logging
Integration Capability
Glovebox & Third-Party Instrument Integration
Application Type
Research, R&D & Pilot Production
Applications
Thin Film Deposition ResearchSemiconductor FabricationOLED & Organic ElectronicsMEMS FabricationMulti-Layer Material Deposition